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ESP32

ESP32 is a series of low-cost, low-power system on a chip microcontrollers with integrated Wi-Fi and dual-mode Bluetooth. The ESP32 series employs either a Tensilica Xtensa LX6 microprocessor in both dual-core and single-core variations, an Xtensa LX7 dual-core microprocessor, or a single-core RISC-V microprocessor and includes built-in antenna switches, RF balun, power amplifier, low-noise receive amplifier, filters, and power-management modules. ESP32 is created and developed by Espressif Systems, a Chinese company based in Shanghai, and is manufactured by TSMC using their 40 nm process.[2] It is a successor to the ESP8266 microcontroller.

Features

ESP32 function block diagram.
ESP32 Die shot, most of the chip is used by a power distribution network

Features of the ESP32 include the following:[3]

ESP32-xx family

Since the release of the original ESP32, a number of variants have been introduced and announced. They form the ESP32 family of microcontrollers. These chips have different CPUs and capabilities, but all share the same SDK and are largely code-compatible. Additionally, the original ESP32 was revised (see ESP32 ECO V3, for example). See also https://gist.github.com/sekcompsci/2bf39e715d5fe47579fa184fa819f421

ESP32

ESP32-S2

ESP32-S3

ESP32-C2

ESP32-C3

NodeMCU board with an ESP32-C3-32S

ESP32-C6

ESP32-H2

Announced

ESP32-C5

ESP32-P4

QFN packaged chip and module

ESP32 is housed in quad-flat no-leads (QFN) packages of varying sizes with 49 pads. Specifically, 48 connection pads along the sides and one large thermal pad (connected to ground) on the bottom.

Chips

The ESP32 system on a chip integrated circuit is packaged in both 6 mm × 6 mm and 5 mm × 5 mm sized QFN packages.

In 2020, chips ESP32-D0WDQ6 and ESP32-D0WD also got a V3 version (ESP32 ECO V3), which fixes some of the bugs[18] and introduces improvements over the previous versions.

Modules

The ESP32 PICO system in package modules combine an ESP32 silicon chip, crystal oscillator, flash memory chip, filter capacitors, and RF matching links into a single 7 mm × 7 mm sized QFN package.

The first released PICO was the ESP32-PICO-D4 with 2 CPUs at 240MHz, 4MiB internal flash, a 40MHz oscillator and 34 GPIOs.[19]

Later, in 2020, the ESP32-PICO-V3 and ESP32-PICO-V3-02 modules were introduced both based on the ESP32 ECO V3 wafer.[20] [21]

In 2022 the ESP32-S3-PICO-1 module was introduced with USB OTG and internal PSRAM.[22]

Printed circuit boards

Surface-mount module boards

ESP32 based surface-mount printed circuit board modules directly contain the ESP32 SoC and are designed to be easily integrated onto other circuit boards. Meandered inverted-F antenna designs are used for the PCB trace antennas on the modules listed below. In addition to flash memory, some modules include pseudostatic RAM (pSRAM).

Development and other boards

SparkFun Thing Plus - ESP32 WROOM

Development & break-out boards extend wiring and may add functionality, often building upon ESP32 module boards and making them easier to use for development purposes (especially with breadboards).

† ESP32 SoC incorporated directly onto development board; no module board used.

Programming

Programming languages, frameworks, platforms, and environments used for ESP32 programming:

Reception and use

Commercial, industrial and academic uses of ESP32:

Use in commercial devices

Use in industrial devices

Academic uses

See also

References

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External links